Hou Yung-Chin

Hou Yung-Chin is listed in filings as SVP and Deputy Co-COO at Taiwan Semiconductor Manufacturing Co Ltd. This profile follows SEC Form 4 activity through Jul 9, 2026, including purchase activity. Recent filings connect the profile to Taiwan Semiconductor Manufacturing Co Ltd (TSM). The current snapshot covers public activity from Jun 9, 2026 to Jul 9, 2026. Reported amounts are shown as $4.7K. The page organizes purchases, sales, issuer links, reported share activity, and filing evidence for review as public disclosure data.